Air Products will highlight advances in its proprietary electron attachment (EA) technology for soldering applications at the IPC APEX Expo in San Diego, California, from February 19th to 21st.

IPC APEX attendees can stop by Air Products Booth #2708 to learn about the advantages of EA activated hydrogen over plasma-based and flux-based processes for cleaning soldering surfaces during electronics assembly and packaging.

These advantages include improved solder wetting, lower reflow temperature, decreased overall voiding tendency, and no flux residue-related problems. In addition, Dr Christine Dong, lead research scientist for merchant gases technology at Air Products, will present the results of a study on EA technology titled “Fluxless Die Attach by Activated Forming Gas.”

The study demonstrates that it is possible to achieve a high-quality die attach with zero or near-zero voids by using EA. Dr Dong’s presentation is part of the Novel Attachment Technologies and Processes (S34) conference paper session to be held on Thursday, February 21, from 10.15am to 12.00pm.

IPC APEX attendees can register to learn how EA-activated forming gas can effectively clean soldering surfaces during fluxless die attach, bringing numerous advantages compared with conventional flux-based processes. Air Products representatives will be available at the booth to speak with IPC APEX attendees about the company’s complete range of application technologies and solutions that can help electronics packaging and assembly customers improve productivity and optimise their total cost of ownership.

Among these solutions are the use of nitrogen reflow for Head-in-Pillow defect reduction and Air Products Inert Wave Soldering technology, which has helped an electronics contract assembly company reduce wave solder defects by 90%, enabling them to achieve improved production efficiencies and cost savings.