Integrated Sensing Systems, Inc.’s (ISSYS) executive vice president, Doug Sparks, will present a paper on MEMS vacuum packaging from aproduct and foundry perspective on August 31, 2011 at the Commercialization of Micro-Nano Systems Conference 2011 (COMS 2011).
Many MEMS devices require vacuum packaging for improved performance and reliability. MEMS-based gyroscopes, accelerometers, pressure sensors, RF-resonators IR-sensors and displays and fuel quality sensors all use vacuum packaging.
Both package-level and wafer level vacuum sealing will be covered in Sparks’ talk at COMS 2011. Thin-film getters, like NanoGetters, are arelatively new development that has been applied to this field both at the chipand ceramic or metal package level. The use of various wafer bonding and packaging methods will be included in the talk, with respect to internal product development and obtaining this technology as a part of a MEMS foundry service.
NanoGetters services more than 40 customers in the MEMS vacuum packaging industry and is a wholly owned affiliate of ISSYS, a leader inadvanced MEMS technologies for industrial, medical devices, microfluidic and scientific analytical sensing applications.
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