ISSYS to deliver talk on MEMS Vacuum Packaging at COMS 2011

Integrated Sensing Systems, Inc.’s (ISSYS) executive vice president, Doug Sparks, will present a paper on MEMS vacuum packaging from aproduct and foundry perspective on August 31, 2011 at the Commercialization of Micro-Nano Systems Conference 2011 (COMS 2011).

Integrated Sensing Systems, Inc.’s (ISSYS) executive vice president, Doug Sparks, will present a paper on MEMS vacuum packaging from aproduct and foundry perspective on August 31, 2011 at the Commercialization of Micro-Nano Systems Conference 2011 (COMS 2011).

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