The Linde Group’s presence and leading position in the semiconductor and electronics industry in the North Pacific Rim and China in particular has been reinforced recently, with a number of multi-year contracts to supply high purity gases to the country’s wafer fabrication plants.

Linde has made a series of major investments in the semiconductor manufacturing industry, an industry which is thought to have grown by around 30% for the past 5 years, and has contracted to supply wafer fabs located in Chengdu, Shanghai and Suzhou. The company is now adding the Dalian project too, which will begin operating in early 2009 and represents a multi-year agreement to supply high purity bulk gases to the new 300mm fab being built.

Noel Leeson, head of Linde Electronics, affirmed the group’s growing position in the region as he said, “This agreement confirms Linde’s position as a technology leader and major supplier of gases and related services to the global electronics industry. It solidifies our relationship with this customer, who we are excited to be working with again, and strengthens our position as the leading gases company in China.”

Steven Fang, head of Linde in China, noted, “We have been working in China for nearly 25 years to help fuel the growth of Chinese industry. Our experience and commitment to the electronics industry, as well as to oil, chemicals and metals manufacturers is evident – Linde’s total investments to date in China exceed $750m.”

The Dalian project is anticipated to begin operating in early 2009 and is expected to be the first of several semiconductor plans on the site. As well as installing an infrastructure for purification, filtration and quality assurance functions, Linde will use its unique Spectra technology to build an integrated ultra-high purity nitrogen and oxygen plant, in addition to a hydrogen generator and supply systems for both argon and helium.