Air Products will highlight its expertise in chemistry and thin film deposition at the upcoming AVS Atomic Layer Deposition (ALD) Conference 2012 being held at the Westin Bellevue in Dresden, Germany, this week from June 17-20.
The ALD conference has grown in importance over the last several years because atomic layer deposition is capable of addressing the fabrication requirements for advanced semiconductor devices.
Manufacturing complex structures, such as high aspect ratio capacitors for DRAM and FinFET/Tri-Gate Transistors for high performance logic devices, are seen as essential for advancing high-performance, mobile- and cloud-based computing applications. ALD is the enabling technology to address these challenges.
Researchers from Air Products will present a number of papers at the show both jointly with R&D partners and in work authored solely by the company.
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