Sensirion AG, a digital microsensor and systems manufacturer, has developed the second generation of its wafer-lever chip-scale package (WLCSP) humidity sensor.
The SHTW2 sensor comes in a flip chip package – one of the simplest and smallest ways to package a semiconductor chip – giving the sensor a miniscule footprint.
The latest device (left) is based on the Switzerland-based corporation’s CMOSens® Technology – a complete sensor system of a single chip with a digital inter-integrated circuit (I2C) interface. The sensor is fully calibrated and covers a humidity measurement range of 0-100% relative humidity (RH) and a temperature range of -30°C to 100°C.
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