Intel has contracted engineering firm Bechtel to build its new semiconductor manufacturing facilities in New Albany, Ohio, and transform the region into the “Silicon Heartland”.
The world’s largest semiconductor chip manufacturer by revenue, Intel has committed to more than $20bn of planned investment in the project. The facility will produce ‘leading-edge’ chips.
With Bechtel as its partner, Intel hopes its largest construction project to date will revitalise chipmaking in the US and help to restore dependability and resilience to the global semiconductor supply chain.
Under the terms of the contract, Bechtel will design and build the first phase of the Intel Ohio project, which in all will be a 2.5 million sq ft facility, including 600,000 sq ft of cleanrooms. Construction will require as much steel as eight Eiffel Towers and as much concrete as the tallest skyscrapers.