German engineering and technology company Bosch has unveiled plans to acquire US chipmaker TSI Semiconductors to boost silicon carbide (SiC) production in California.
The news is part of Bosch’s wider $1.5bn plan to convert TSI Semiconductors’ manufacturing facilities to state-of-the-art processes.
Bosch hopes to produce its first chips on 200-millimeter wafers based on the innovative material silicon carbide (SiC) in 2026.
Based in Roseville, California, TSI develops large volumes of chips on 200-millimeter silicon wafers for applications in mobility, telecommunications, energy, and life sciences industries.
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