Bosch to acquire US-based TSI Semiconductors
German engineering and technology company Bosch has unveiled plans to acquire US chipmaker TSI Semiconductors to boost silicon carbide (SiC) production in California.
The news is part of Bosch’s wider $1.5bn plan to convert TSI Semiconductors’ manufacturing facilities to state-of-the-art processes.
Bosch hopes to produce its first chips on 200-millimeter wafers based on the innovative material silicon carbide (SiC) in 2026.
Based in Roseville, California, TSI develops large volumes of chips on 200-millimeter silicon wafers for applications in mobility, telecommunications, energy, and life sciences industries.
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