Samsung Electronics has announced Young Hyun Jun as its new Head of Device Solutions (DS) division to lead the company’s semiconductor business.
Confirmed by the South Korea-based electronics firm today (21st May), the appointment will see Jun head many of Samsung’s mega projects. These include the recently announced $18bn investment to build two new fabs at its Texas campus.
With the addition of investment through the CHIPS and Science Act, Samsung is also expected to invest a further $40bn+ in the US in the coming years, making it one of the largest foreign direct investments for a greenfield project in US history.
Read more: Samsung to invest over $40bn in Texas semiconductor projects, bolstered by Biden’s CHIPS Act
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