Global semiconductor firm Texas Instruments Incorporated (TI) will build its next 300-millimetre semiconductor wafer fabrication plant in Lehi, Utah, as part of a ‘historic’ $11bn economic investment for the state.
Set to be on-stream in 2026, the new fab will be located next to TI’s existing 300mm semiconductor wafer fab in Lehi, with the two fabs operating as one single site.
Construction of the second plant is expected to begin in the second half of 2023.
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