Taiwanese chip giant Taiwan Semiconductor Manufacturing Company (TSMC) has more than tripled its investment in the US, after announcing plans for a second fab in Phoenix, Arizona at an event that included presentations by US President Joe Biden and Apple CEO Tim Cook.
The new site is in addition to the company’s first fab at the same location, which is now taking shape and is scheduled to begin production of N4 process technology in 2024.
TSMC’s second fab will begin production of 3nm process technology in 2026.
Together, the two fabs will form TMSC Arizona and will manufacture over 600,000 wafer per year, with an estimated end-products value of more than $40bn.
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