The US National Science Foundation has invested $45.6m to progress new semiconductor technologies and manufacturing methods in support of a domestic supply chain.
A portion of the allocated funding is from the CHIPS and Science Act, and each project will be supported by the NSF Future of Semiconductors (FuSe) programme through a public-private partnership.
Formed of the US National Science Foundation, Ericsson, IBM, Intel, and Samsung, the public-private partnership will help to inform research needs and accelerate technology translation to the market and prepare the future workforce.
In turn, this will help address the growing demand for semiconductors in the US.
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