Intel will invest up to $4.6bn in a new semiconductor assembly and test facility in Poland to meet critical demand for assembly and test capacity that is expected by 2027.
Combined with the company’s existing wafer fabrication facility in Ireland, and its planned wafer fabrication facility in Germany, Intel says the new location will create what it says will be a first-of-its-kind end-to-end semiconductor manufacturing value chain in Europe.
Design and planning for the facility will begin immediately, with construction set to begin upon European Commission approval.
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