Global semiconductor firm Texas Instruments (TI) has broken ground on a new 300-mm semiconductor wafer fabrication plant in Lehi, Utah, as part of a $11bn investment.
Dubbed LFAB2, the facility will connect TI’s existing 300-mm wafer fab in Lehi. Once complete, TI’s two Utah fabs will manufacture tens of millions of analog and embedded processing chips every day.
In February 2023, TI announced its $11bn investment, marking what is believed to be the largest economic investment in state history.
Haviv Ilan, President and CEO of TI, said the new fab is part of a long-term, 300-mm manufacturing roadmap to build the capacity customers will need for decades to come.
... to continue reading you must be subscribed
